Analog Devices HMC8108 Low Noise Converters


Analog Devices HMC8108 Low Noise Converters
Analog Devices HMC8108 Low Noise Converters

Analog Devices HMC8108 Low Noise Converters

Analog Devices HMC8108 Low Noise Converters are offered as compact, X-band, gallium arsenide (GaAs), monolithic microwave integrated circuit (MMIC) in-phase/quadrature (I/Q) converters. The HMC8108 series converts 9GHz to 10GHz radio frequency (RF) input signals to a typical 60MHz single-ended intermediate frequency (IF) signal at its output. The HMC8108 Converters deliver a small signal conversion gain of 13dB with a noise figure of 2dB. The converters also have 20dBc image rejection.

The HMC8108 Converters are designed with a low noise amplifier followed by an image reject mixer. The image reject mixer eliminates the need for a filter following the low noise amplifier and removes thermal noise at the image frequency. I/Q mixer outputs are provided, and an external 90° hybrid is needed to select the required sideband. Compatible with surface-mount manufacturing techniques, the HMC8108 converters serve as a much smaller alternative to hybrid style, image reject mixer, down converter assemblies.


  • Conversion gain: 13dB typical
  • Image rejection: 20dBc typical
  • Noise figure: 2dB typical
  • Input power for 1dB compression: −4dBm typical
  • Input third-order intercept: 6dBm typical
  • Output saturated power: 10dBm typical
  • LO leakage at the IF port: −20dBm typical
  • LO leakage at the RF port: −37dBm typical
  • 32-terminal, 5mm × 5mm, ceramic leadless chip carrier (LCC)

  • Point-to-point and point-to-multipoint radios
  • Military radar
  • Satellite communications
Block Diagram
Block Diagram

Analog Devices EVAL-HMC8108 Evaluation Board

Analog Devices EVAL-HMC8108 Evaluation Board helps designers evaluate the features of the 9GHz to 10GHz HMC8108 Low Noise Converters. Developed using RF circuit design techniques, the board provides a sufficient number of via holes to connect the top and bottom ground planes. Signal lines with 50Ω impedance connect the package ground leads and exposed pad directly to the ground plane.

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DRAM will register a greater than 40% jump, its largest annual increase ever!

Historically, the DRAM market has been the most volatile of the major IC product segments. Figure 1 reinforces that statement by showing that the average selling price (ASP) for DRAM has more than doubled in just one year.  In fact, the September Update to The McClean Report will discuss IC Insights’ forecast that the 2017 price per bit of DRAM will register a greater than 40% jump, its largest annual increase ever!

Just one year ago, DRAM buyers took full advantage of the oversupply (excess capacity) portion of the cycle and negotiated the lowest price possible with the DRAM manufacturers, regardless of whether the DRAM suppliers lost money on the deal. Now, with tight capacity in the market, DRAM suppliers are getting their “payback” and charging whatever the market will bear, regardless of whether the price increases hurt the users’ electronic system sales or causes it to lose money.

Figure 1

The three remaining major DRAM suppliers—Samsung, SK Hynix, and Micron—are each currently enjoying record profits from their memory sales.  For example, Micron reported net income of $1.65 billion on $5.57 billion in sales—a 30% profit margin—in its fiscal 3Q17 (ending in May 2017).  In contrast, the company lost $170 million in its fiscal 4Q16 (ending August 2016).  A similar turnaround has occurred at SK Hynix.  In 2Q17, SK Hynix had a net profit of $2.19 billion on sales of $5.94 billion—a 37% profit margin.  In contrast, SK Hynix had a net profit of only $246 million on $3.39 billion in sales one year ago in 2Q16.

Previously, when DRAM capacity was tight and suppliers were enjoying record profits, one or more suppliers eventually would break rank and begin adding additional DRAM capacity to capture additional sales and marketshare. At that time, there were six, eight, or a dozen DRAM suppliers.  If the supplier was equipping an existing fab shell, new capacity could be brought on-line relatively quickly (i.e., six months).  A greenfield wafer fab—one constructed on a new site—took about two years to reach high-volume production.  Will the same situation play out with only three DRAM suppliers left to serve the market?

Recently, Micron stated that it does not intend to add DRAM wafer capacity in the foreseeable future.  Instead, it will attempt to increase its DRAM output by reducing feature size that, in turn, reduces die size.   Eventually, as the company moves down the learning curve, it will be able to ship an increasing number of good die per wafer.  However, SK Hynix, in its 2Q17 financial analyst conference call, stated that it plans to begin adding DRAM wafer capacity since it is not able to meet increasing demand by technology advancements alone.  Samsung has been less forthcoming in its plans for future DRAM production capacity.

Although Samsung and Micron may tolerate SK Hynix’s DRAM expansion efforts for a short while, IC Insights believes that both companies will eventually step up and add DRAM wafer start capacity to protect their marketshare—and DRAM ASPs will begin to fall.  As the old saying goes, it only takes two companies to engage in a price war—and there are still three major DRAM suppliers left.

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Molex Debuts Polymicro FR Optical Fibers

UL 94 V-0 low flammability rated optical fiber for industrial and telecommunications networks

“Strong, durable Molex Polymicro FR Fibers meet industry requirements for flammability protection.”

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“Having a fiber with a low flammability buffer coating offers a distinct advantage in applications where enhanced flammability protection is of paramount importance,” said Jim Clarkin, Polymicro general manager, Molex. “Strong, durable Molex Polymicro FR Fibers meet industry requirements for flammability protection.”

Polymicro FR Optical Fibers are available in telecommunications grade singlemode or 50µm and 62.5µm graded index construction with a 125µm glass OD/250µm buffer OD. Designed for superior dimensional control and tight tolerances, Polymicro FR Optical Fibers have an operational temperature range of -40 to +100°C. The UL 94 V-0 flammability rating indicates characteristics recommended in applications requiring increased protection from flame propagation and combustion.

The buffer utilized in Polymicro FR Optical Fiber is mechanically strippable similar to an acrylate buffer and imparts exceptional fiber strength. Molex can provide multiple size fibers and buffers, including multimode step index constructions. Available as single fiber in a variety of jacketing materials, Polymicro FR Optical Fibers range from less than 50 microns to over 600 microns in core diameter.

Molex vertically integrated manufacturing capabilities enable production of a complete range of optical fibers designed for deep-UV, NIR and broad-spectrum applications. Polymicro Optical Fiber assembly design configurations are highly customizable, incorporating optomechanical and electromechanical components with custom configured fused silica, in addition to advanced optical features including micro-machined end tips, metal terminations or precision couplings. Fiber type, termination style and jacketing can be specified for optimal application alignment and system performance.

“Molex customer design requirements vary widely in complexity—from a single, finished optical fiber to a complex branching assembly. Our expanding range of Molex Polymicro Optical Fiber profiles and custom assemblies give customers the design flexibility they need for demanding applications, environmental conditions and optical wavelengths,” adds Clarkin.

For more information about Polymicro FR Optical Fiber please visit

About Molex:

Molex brings together innovation and technology to deliver electronic solutions to customers worldwide. With a presence in more than 40 countries, Molex offers a full suite of solutions and services for many markets, including data communications, consumer electronics, industrial, medical, automotive and commercial vehicle. For more information, please visit

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Semiconductor industry records best second quarter in 3 years

Despite a slightly down first quarter, the semiconductor industry achieved near record growth in the second quarter of 2017 posting a 6.1% growth from the previous quarter, according to IHS Markit. Revenues came in at US$101.4 billion, up from US$95.6 billion in the first quarter of 2017. This is the highest growth the industry has seen in the second quarter since 2014.

The memory chip market set records in the second quarter, growing 10.7% to a new high of US$30.2 billion with DRAM and NOR flash memory leading the charge, growing 14% and 12.3%, respectively, on quarter.

“The DRAM market had another quarter of record revenues on the strength of higher prices and growth in shipments,” said Mike Howard, director for DRAM memory and storage at IHS Markit. “Anxiety about product availability in the previous third and fourth quarters weighed on the industry. This led many DRAM buyers to build inventory – putting additional pressure on the already tight market. This year is shaping up to smash all DRAM revenue records and will easily pass the US$60 billion mark.”

“For NOR, the supply-demand balance has tightened raising average selling prices and revenue,” said Clifford Leimbach, senior analyst for memory and storage at IHS Markit. “This mature memory technology has been in a steady decline for many years, but some market suppliers are reducing supply or leaving the market, which has tightened supply recently, resulting in the increase of revenue.”

In terms of application, consumer electronics and data processing saw the most growth, increasing in revenues by 7.9% and 6.8%, respectively, on quarter. A lot of this growth can be attributed to the continual growth in memory pricing, as supply still remains tight, accordig to IHS.

Industrial semiconductors showed the third highest growth rate at 6.4% during the same period, IHS said. This growth can be attributable to multiple segments, such as commercial and military avionics, digital signage, network video surveillance, HVAC, smart meters, traction, PV inverters, LED lighting and medical electronics including cardiac equipment, hearing aids and imaging systems.

Another trend in the industrial market is increasing factory automation, which alone is driving growth for discrete power transistors, thyristors, rectifiers and power diodes. The market for these devices is expected to reach US$8 billion in 2021, up from US$5.7 billion in 2015, IHS indicated.

Intel remains the number one semiconductor supplier in the world, followed by Samsung Electronics by a slight margin. Foundry operations and other non-semiconductor revenues are not included in IHS’ semiconductor market rankings.

Among the top 20 semiconductor suppliers, AMD and Nvidia achieved the highest sequential revenue growth with 24.7% and 14.6%, respectively, IHS said. There was no market share movement in the top 10 semiconductor suppliers. However, seven of the 10 companies in the 11 to 20 market share slots did change market share.

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