Sell your Excess Inventory

Sell your Excess Inventory


 

Purchase

We are ready to buy excess electronic components! So if you or someone you know, is selling their inventory, check out our website! http://www.nusourcetech.com/sellYou can send us a file or enter the part numbers online.

These inventory management programs are designed to convert excess inventory from liability to a cash asset.

The lot buy program is a great idea for companies who need to get that older inventory off of their shelves and out of their warehouse immediately. This will also save money by eliminating the carrying costs of holding and warehousing surplus inventory. Nu Source Technologies will give you an accurate response on your excess electronics components usually within 24 hours.

Please contact us today for more details. We also offer an on-site evaluation for moving or closing companies. We take it all!

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PR News: Artesyn Adds 72 New Models to Rail DC-DC Converter Module Family

Artesyn Adds 72 New Models to Rail DC-DC Converter Module Family

Tempe, Ariz. [25 May, 2017] — Artesyn Embedded Technologies today added 72 new models to its ERM family of dc-dc converter modules designed to meet the power demands and safety standard requirements of railway rolling stock applications. Covering 10 and 20 watt power output ratings, each series includes models with single 5 V, 12 V, 15 V, 24 V, or dual +/- 12 V or +/- 15 V outputs and input ranges of 9 Vdc to 36Vdc, 18 Vdc to 75 Vdc or 40 Vdc to 160 Vdc.

Encapsulated in a 1-inch by 2-inch DIP package (25.4 x 50.8), the ERM family is protected from atmospheric conditions without additional conformal coating. The dc-dc converter modules have a wide operating temperature range of minus 40 degrees Celsius to 85 degrees Celsius with derating. An optional heat sink can help heat dissipation and improve performance at high operating temperatures.

A reinforced insulation system with 3000 Vac RMS I/O isolation, combined with high EMC immunity, qualifies these new dc-dc converters for the many demanding embedded power applications in railway and other transportation systems. It is ideal for rolling stock applications such as engine management, traction control, door control, video surveillance, communications, entertainment, lighting and other on-board electrical equipment.

The first two series in the ERM family, the ERM75 and ERM50, offer 75 W and 50 W maximum power output respectively. Artesyn’s new ERM family builds on an existing portfolio of standard ac-dc and dc-dc power conversion products that are already widely used in rail control and infrastructure applications, such as signaling, control systems, access control, ticketing, RFID and information displays.

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Tackling the E-Waste Problem

Elektronikschrott

Focused on procuring raw materials and other goods that their companies need to be able to make their own products, electronics buyers don’t always get to see the electronic waste or “e-waste” that starts to pile up when technology becomes obsolete, inoperable, or otherwise unusable.

But it’s there. In fact, e-waste is accumulating at an alarming rate in our tech-centric world, where applications, equipment, and electronics can become obsolete almost as quickly as they are brought to market.

What Is E-Waste?
e-waste is defined as “any electronic waste that is no longer wanted or is now obsolete, whether it works or not.” That includes, but isn’t limited to, TVs, VCRs, DVD players, stereos, copiers, fax machines, tablets, computers, and mobile phones. Not always easy or convenient to recycle—local governments often have e-waste collection days a few times a year—this type of waste tends to gather dust until someone unceremoniously tosses it out with the “regular” trash.

The amount of e-waste that hits U.S. landfills every year is staggering. Earth911 says Americans throw away 9.4 million tons of electronics every year, and that simply recycling one million laptops would save the energy equivalent to the electricity used by 3,657 U.S. homes in a year, according to the EPA.

Only 12.5% of e-waste is recycled, making it one of the fastest-growing segments in the municipal solid waste stream. “Although nearly 100% of e-waste is recyclable, the current recycling rate of e-waste is not promising,”  noting that the items that can be recovered from e-waste include constituents such as plastics, metals, and glass.

One Stanford researcher is trying to help stem the flow of e-waste into the world’s landfill with a new, biodegradable semiconductor that would fully degrade when it comes into contact with a weak acid such as vinegar, according to a report in Zhenan Bao and her team in the Stanford lab have been experimenting with different types of next-gen applications “inspired by the human skin,” New Atlas’ Lisa-Ann Lee writes, “from a stretchable electrode that could help prostheses users regain their sense of touch to paper-thin heart sensors and self-healing, pressure-sensitive plastic polymers.”

As part of that experimentation, Bao has been trying to mimic the function of human skin to think about how to develop future electronic devices, and how to combine electronic properties with biodegradability. “We came up with an idea of making these molecules using a special type of chemical linkage that can retain the ability for the electron to smoothly transport along the molecule,” Bao told New Atlas, adding that the chemical bond “is sensitive to weak acid—even weaker than pure vinegar.”

While still a work in progress, this new semiconductor could help introduce biodegradability into various applications, thus helping to reduce e-waste during an era where the number of electronics in use—and, ready to toss out—continues to exacerbate every year.

MILITARY INNOVATORS AWARDS VIDEO SHOWCASE

MILITARY INNOVATORS AWARDS VIDEO SHOWCASE

Abaco's AXIS – Advanced Integrated Software Development Tools Recognized with a Gold Award by the Military & Aerospace Electronics Innovator’s Awards program

Abaco’s AXIS – Advanced Integrated Software Development Tools Recognized with a Gold Award by the Military & Aerospace Electronics Innovator’s Awards program

AXIS is a complete development environment designed to minimize the cost, risk and time-to-deployment of multi-processor and multi-board military embedded computing applications. It provides a complete set of powerful, flexible, intuitive tools and libraries that support the entire development process, from design through debugging, optimization and testing. Applications developed with AXIS are both scalable and portable.

Military & Aerospace Electronics 2016 Innovators Awards Program Platinum Level Winner: V-SHIELD® DC-DC converter packaging

Military & Aerospace Electronics 2016 Innovators Awards Program Platinum Level Winner: V-SHIELD® DC-DC converter packaging

The Military & Aerospace Electronics Innovators Awards platinum level recognition is reserved for military and aerospace electronics featuring superb innovation which is characterized by a groundbreaking approach to meeting a need, a new level of performance, efficiency and/or ease-of-use. This video covers how VPT reached each of these benchmarks with its rugged, fully encapsulated DC-DC converter V-SHIELD® epoxy packaging

Phoenix International Systems' RPC24

Phoenix International Systems’ RPC24

Ruggedized 2U Removable Magazine RAID is host OS independent and supports RAID 0, 1, 5, 6, 10, 50 and 60 levels on up to 24 SAS/SATA storage devices with dual redundant hot swap power supplies and quad redundant hot swap cooling fans. The RPC24 supports TCG compliant and FIPS 140-2 certified encryption, secure erase and certified to military specification MIL-STD-810G and MIL-STD-461E.

Rugged Airframe Cable Assemblies

Rugged Airframe Cable Assemblies

Today more than 75% of microwave cables fail frequently, with about 36% needing to be replaced once a year. GORE-FLIGHT™ Microwave Assemblies, 6 Series are lightweight cable solutions that provide a true “fit-and-forget” installation option, delivering the lowest insertion loss before and after installation, and ensuring reliable performance for the life of the system.

Curtiss-Wright M60 Main Battle Tank Turret Drive System Upgrade

Curtiss-Wright M60 Main Battle Tank Turret Drive System Upgrade

Upgrading M60 battle tanks with modern electro-mechanical turret drive systems provides a quick, cost-effective solution for significantly boosting the performance of older hydraulic and hybrid turret drive-based battle tanks. This enables them to meet the threat posed by newer and far more costly platforms.

Applied Avionics, Inc. – LOGIC Component Technology

Applied Avionics, Inc. – LOGIC Component Technology

LOGIC Component Technology inside of VIVISUN® lighted pushbutton switches offers over 1,000,000 system integration solutions. Mix-and-match components include latching flip-flops, solid state relays, Boolean logic gates, voltage sensors, pulse/timers, electronic rotaries, diodes and terminal junctions.

Award-Winning ARINC 653 RTOS

Wind River Award-Winning ARINC 653 RTOS

Wind River® VxWorks® 653 is the leading RTOS for ARINC 653 time/space separated systems and is proven in over 200 customers in over 400 programs and flying in over 80 aircraft.

 

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News Update: Linear Technology Corporation, announces the LTC5553, a double balanced mixer

Ultra-Wideband 3GHz to 20GHz Mixer with Integrated LO Buffer Offers 23.9dBm IIP3 in a Tiny 3mm x 2mm Package
An Ultra-Wideband 3GHz to 20GHz,
High Linearity Mixer Integrates LO Buffer

MILPITAS, CA and NORWOOD, MA – May 23, 2017 – Analog Devices, Inc., which recently acquired Linear Technology Corporation, announces the LTC5553, a double balanced mixer providing best-in-class matched bandwidth capability from 3GHz to 20GHz. The mixer can be used either as an up- or downconverter. In addition, the LTC5553 delivers outstanding linearity of 23.9dBm IIP3 at 14GHz, and 21.5dBm at 17GHz. The device integrates an LO buffer requiring only 0dBm input drive, effectively eliminating an external high power LO amplifier circuit. Moreover, the LTC5553 integrates wideband balun transformers on chip. So all ports operate single-ended, 50Ω matched over their respective specified frequency range. In addition, the mixer has excellent port-to-port isolation, offering –32dBm LO to RF leakage at 17GHz, thus easing external filtering requirements. All of these features result in minimum external components, simplified design and a very small solution size.

LTC5553 Package

The LTC5553’s extremely wide bandwidth and performance is ideal for a wide range of applications including 5G microwave backhaul, broadband wireless services, satellite broadband radios, radar systems, active antenna arrays, X and Ku band transceivers, test equipment, spectrum analysis and satellite communications.

The LTC5553 is offered in a tiny 12-lead, 3mm x 2mm plastic QFN package. The device is rated for operation from –40°C to 105°C case temperature to support extended environmental operating temperature. The mixer is powered from a single 3.3V supply, drawing a quiescent supply current of 132mA. Additionally, the LTC5553 can be shut down via an enable pin. When deactivated, the device draws only 100μA maximum standby current. The enable pin can be driven directly to turn the device on and off rapidly in less than 0.2μs, supporting time-division duplex (TDD) or burst mode type transmitters and receivers. The LTC5553 is priced starting at $22.00 each in 1,000-piece quantities. Samples and production quantities are available immediately.

Summary of Features: LTC5553

  • Matched RF Frequency:     3GHz to 20GHz
  • Matched LO Frequency:     1GHz to 20GHz
  • Matched IF Frequency:       500MHz to 9GHz
  • Up- or Downconversion
  • High Input IP3:                    23.9dBm at 14GHz
    21.5dBm at 17GHz
  • Low LO Drive Level:           0dBm
  • Low LO-RF Leakage:         –32dBm at 17GHz
  • Low Conversion Loss:        11dB at 17GHz

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Stocks News: Benchmark Electronics, TTM Technologies, and Sanmina are among the best investor bets

Benchmark Electronics, TTM Technologies, and Sanmina are among the best investor bets in the printed circuit board market this year.

Printed circuit board stocks have been very kind to investors lately. It is almost impossible to find a ticker in this sector that hasn’t been beating the S&P 500 market tracker over the last 52 weeks.

How do you pick the top names in this broadly lucrative industry? I’m here to show you my three favorites in the printed circuit board market: Sanmina (NASDAQ:SANM), Benchmark Electronics (NYSE:BHE), and TTM Technologies (NASDAQ:TTMI), each one tailor-made for a different type of investor.

The towering giant

Sanmina’s annual revenues are larger than TTM’s and Benchmark’s total sales put together. Printed circuit boards are a small component in this electronics manufacturing giant’s global empire, with 45,000 employees spread out over 25 countries and six continents.

The company is among the world’s largest circuit board manufacturers, but it consumes most of these materials in the process of putting together shelf-ready products for its customers. Sanmina does sell a small amount of printed circuit boards, cables, and other components directly to other electronics manufacturers and other clients, charging a small markup for these contracts.

Components and products produced 26% of Sanmina’s gross profits over the last six months, culled from just 20% of the company’s total sales.

The stock trades at just 13.6 times trailing earnings, and Sanmina investors have enjoyed a 49% return over the last year. Book-to-bill ratios stand at 1.1 today, which is a sign of revenue growth coming down the order pipeline. If you want safety and stability, this is your printed circuit board stock.

The over-achieving cash machine

Like Sanmina, Benchmark Electronics makes most of its hay from electronics manufacturing services. Benchmark may not be able to match Sanmina’s economies of scale, but it’s an extremely efficient cash machine.

The company produced free cash flows of $241 million in the last four quarters, based on $2.3 billion in top-line sales. That works out to a 10.5% cash margin, far above Sanmina’s 3.1%.

Moreover, Benchmark has been growing its cash profits steadily in the last three years. The company is pursuing even wider gross profit margins by doubling down on opportunities in the medical, industrial, and sensor markets. Benchmark’s highest-margin divisions grew their sales in 2016, while the less profitable computing and telecommunications segments swooned.

Benchmark should continue to raise large cash profits out of modest revenues. The stock is trading at just 4.4 times trailing free cash flows, making it an attractive target for investors with an eye for strong cash generation.

The bottom-line growth story

Finally, TTM Technologies is the purest play on circuit boards you’ll find anywhere. The market is fragmented, and many of its rivals include printed circuit boards as part of a diverse strategy, like Sanmina and Benchmark. But it’s all TTM does. Hidden in the name is another clue to TTM’s unique market position, focusing on quick “time to market” delivery of circuit board orders.

That strategy puts TTM at the vanguard of pretty much every technology sea change. This is where you go when you want to be first to market with a game-changing consumer product or military tool. The company was a major supplier to cell phone and tablet makers when those products categories were new and exciting. Today, TTM is exploring fresh vistas in automotive computing, with continued support from the smartphone market.

The billion-dollar merger with rival Viasystems in 2015 gave TTM’s revenues an overnight boost while adding the target company’s roster of auto makers to TTM’s customer Rolodex. That deal looks more prescient than ever, as automotive computing slides deeper into the mainstream.

TTM’s share prices have more than doubled in 52 weeks, but they still trade at less than 9 times forward earnings estimates and roughly 7 times trailing free cash flows. This company is going places, taking investors along for an enriching ride.

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Xilinx: Enabling Vision Guided Machine Learning Applications with reVISION

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Xilinx: Enabling Vision Guided Machine Learning Applications with reVISION™

Challenge

  • Today’s embedded vision systems have evolved to include vision guided machine learning applications that need to be highly responsive, flexible enough to keep up with latest networks and sensor technology, and have the ability to connect to any machine (IoT).

Solution

Xilinx® SoC and MPSoC devices uniquely address the requirements of today’s vision guided machine learning applications but traditionally have been hard to adopt for those without expert hardware or RTL-based design experience. The reVISION stack breaks through this barrier to adoption to include software defined development resources for platform, algorithm and application development.

  • No Hardware Expertise Required
    • Familiar eclipse-based development environment using C, C++ and/or OpenCL languages
    • Accelerate development with ready to use OpenCV libraries
    • Support for popular frameworks and neural networks
  • Responsiveness – Lowest Latency From Sensor To Inference and Control
    • Up to 6x better images/second/watt in machine learning
    • 42x higher frames per second for computer vision processing
    • 1/5 the latency (in milliseconds)
  • Reconfigurability for Latest Networks and Sensors
    • Only devices to offer ‘future-proof’ hardware reconfigurability to keep up with rapidly evolving neural networks and sensor evolution
  • Any-to-Any Connectivity and Sensor Interfaces
    • Up to 12x more bandwidth relative to alternative SoCs currently in the market, including support for native 8K and custom resolutions
    • Significantly more high and low bandwidth sensor interfaces and channels, enabling highly differentiated combinations of sensors such as RADAR, LiDAR, accelerometers and force torque sensors
    • Industry-leading support for the latest data transfer and storage interfaces, easily reconfigured for future standards

Trend

  • Designers always wanted more flexibility in planning the circuit layout and achieve an overall PCB routing that is more manageable and straightforward.
  • New designs are moving toward smaller, more robust solution. For optocoupler gate drivers, the trend is towards higher integration.
  • Low-profile components are preferred over higher profile ones. For example, a low profile single transformer for each driver enables improved reliability and robustness compared to heavier, higher profile transformers that are more vulnerable to mechanical vibration.

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